Huawei is attempting to avoid US chip sanctions, trade body alleges

Chinese telecommunications company Huawei is building a collection of secret semiconductor fabrication facilities across China, according to the US trade group Semiconductor Industry Association (SIA).

On Tuesday, Bloomberg published claims from the SIA that Huawei had received around $30 billion in funding from the Chinese government, in addition to acquiring two chip manufacturing plants and building three others in the region.

The trade association also alleged that Huawei is attempting to circumvent the restrictions placed on the US chip makers by the US government by constructing the facilities under the names of other companies.

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